Paras Semiconductors, BroadPak join hands to build advanced semiconductor packaging capabilities

T1Covered by 1 source · first reported by Economic Times — Tech / Technology / Startups / ETTelecom at 06 Nov, 15:45 UTC

The collaboration will combine Paras Semiconductors' manufacturing ambitions in opto-electronics, photonics and co-packaged optics with BroadPak's technology expertise in advanced semiconductor packaging, heterogeneous integration and chiplet-based system architectures, it said.

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Sources

• T1Paras Semiconductors, BroadPak join hands to build advanced semiconductor packaging capabilitiesEconomic Times — Tech / Technology / Startups / ETTelecom06 Nov, 15:45