India's RRP Electronics opens advanced wafer-level packaging facility in Navi Mumbai

T2Covered by 1 source · first reported by DigiTimes (headlines) at 15 Oct, 07:59 UTC

India's RRP Electronics has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor unit in Navi Mumbai, Maharashtra, adding SIM and eSIM module production and specialized testing to its outsourced semiconductor assembly and test (OSAT) operations. The facility opened on…