Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 08 Oct, 07:18 UTC

Rohm Semiconductor retains wafer fabrication in-house as it expands its back-end semiconductor operations and R&D footprint in India. The post Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing appeared first on EE Times.

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Sources

• T2Rohm Semiconductor Expands Back-End Chip Manufacturing OutsourcingSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly08 Oct, 07:18