SEMICON India 2026: India Starts Packaging Chips as Ecosystem Takes Shape

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 23 Sept, 10:56 UTC

India moves five chip packaging plants into production as $13.5 billion ISM 2.0 expands manufacturing, design, and engineering capabilities. The post SEMICON India 2026: India Starts Packaging Chips as Ecosystem Takes Shape appeared first on EE Times.

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Sources

T2SEMICON India 2026: India Starts Packaging Chips as Ecosystem Takes ShapeSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly23 Sept, 10:56