Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 28 Sept, 23:18 UTC

In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC advanced packaging executive, reflected on the early development of CoWoS. In the first of this two-part series, Jeng details…

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Sources

• T2Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging winJP/KR/TW: Korea Herald / Taipei Times / DigiTimes28 Sept, 23:18