Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 28 Sept, 23:18 UTC

As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging. In the second part of his interview with DIGITIMES, Dr. Shin-Puu Jeng, chairman of IMAPS and a former TSMC…

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Sources

• T2Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standardJP/KR/TW: Korea Herald / Taipei Times / DigiTimes28 Sept, 23:18