Impact of Cu Microstructure On The TSV-Induced Residual Stress Within Silicon (Purdue, UCLA)

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 28 Sept, 18:02 UTC

Researchers at Purdue University and the UCLA published a technical paper titled “Experimental Evidence for the Impact of Copper Microstructure on Residual Stress of Through Silicon Via.” Abstract Excerpt: “Here, we experimentally quantify the impact of Cu microstructure on the TSV-induced residual…

hardwarescience

Sources

• T2Impact of Cu Microstructure On The TSV-Induced Residual Stress Within Silicon (Purdue, UCLA)Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly28 Sept, 18:02