Ceva and Mobilint Bring Physical AI Closer to Everyday Devices

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 05 Nov, 16:00 UTC

Physical AI is moving closer to everyday reality, and a new collaboration between Ceva and Mobilint offers an encouraging example of how that progress can reach commercial devices. Mobilint’s REGULUS edge AI System-on-Chip brings together Ceva’s SensPro AI DSP and NeuPro-Nano NPU, marking the first…

hardware

Sources

• T2Ceva and Mobilint Bring Physical AI Closer to Everyday DevicesSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly05 Nov, 16:00