A System-Level Approach To Protecting 3D-IC Signal Integrity

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 05 Nov, 08:04 UTC

Accurate SI analysis must account for interactions across vertical interconnects, interposers, silicon bridges, package transitions, and neighboring high-speed channels. The post A System-Level Approach To Protecting 3D-IC Signal Integrity appeared first on Semiconductor Engineering.

hardware

Sources

• T2A System-Level Approach To Protecting 3D-IC Signal IntegritySemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly05 Nov, 08:04