Reimagining 3D IC Design: From Architecture to Signoff

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 04 Nov, 16:00 UTC

By Keith Felton, Andras Vass-Varnai and Todd Burkholder, Siemens EDA The semiconductor industry is undergoing a fundamental transformation. Heterogeneous integration, the practice of combining multiple chiplets and specialized components into a single advanced packaging platform, has emerged as a…

hardware

Sources

• T2Reimagining 3D IC Design: From Architecture to SignoffSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly04 Nov, 16:00