High-speed optical communications drive demand for mSAP competition among Taiwan PCB makers

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 04 Nov, 05:55 UTC

As AI computing clusters continue to expand, data centers are demanding higher transmission speeds and greater bandwidth. To overcome the manufacturing bottlenecks of traditional high-density interconnect (HDI) technology, modified semi-additive processes (mSAP) are rapidly emerging as the new…