3D Integration Reduces Embodied-Emissions Impact Of GPU Scaling (imec, VUB)

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 02 Nov, 20:00 UTC

Researchers at imec and Vrije Universiteit Brussels published “Embodied Emissions of 2.5D and 3D Scaling in Chipletized GPUs for Low-Carbon AI.” Abstract “GPU compute resources are scaling to support growing AI workloads, leading to further rises in the climate change impact of hyperscale data…

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Sources

• T23D Integration Reduces Embodied-Emissions Impact Of GPU Scaling (imec, VUB)Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly02 Nov, 20:00