AI Image Enhancement Improves Detection Of Flip-Chip Interconnect Defects (MCL, PVA TePla, ASE)

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 02 Nov, 21:08 UTC

Researchers at Materials Center Leoben, PVA TePla, and Advanced Semiconductor Engineering (ASE) published “AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic Packaging.” Abstract Excerpt: “Traditional failure-analysis (FA) methods face growing challenges due to…

hardwarescience

Sources

• T2AI Image Enhancement Improves Detection Of Flip-Chip Interconnect Defects (MCL, PVA TePla, ASE)Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly02 Nov, 21:08