Samsung chairman Lee Jae-yong turns to Japan for AI chip packaging edge

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 02 Nov, 04:09 UTC

Samsung Electronics chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on November 1, as the chipmaker looks to Japan's semiconductor materials and equipment industry to strengthen its advanced packaging capabilities for AI processors.