Why Shrinking Component Geometries Force a Rethink of BGA Rework Heating Methods

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 30 Oct, 10:32 UTC

As components shrink to 01005 scale and board densities rise, BGA rework requires more precise heat control. The post Why Shrinking Component Geometries Force a Rethink of BGA Rework Heating Methods appeared first on EE Times.

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Sources

• T2Why Shrinking Component Geometries Force a Rethink of BGA Rework Heating MethodsSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly30 Oct, 10:32