ACM Shanghai ships first 310×310mm panel-level plating tool as order backlog surges 88%

T2Covered by 1 source · first reported by DigiTimes (headlines) at 30 Oct, 03:08 UTC

As AI chip packages continue to grow in size, panel-level packaging equipment is gradually advancing toward customer validation and volume production.

hardware

Sources

• T2ACM Shanghai ships first 310×310mm panel-level plating tool as order backlog surges 88%DigiTimes (headlines)30 Oct, 03:08