Taiflex, E Ink accelerate PTFE development for AI connectivity materials

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 29 Oct, 23:57 UTC

Flexible copper-clad laminate (FCCL) maker Taiflex Scientific announced on October 28 that its board had approved a memorandum of understanding with global e-paper leader E Ink Holdings (EIH) to jointly develop AI high-speed connectivity materials. The partnership combines E Ink's expertise in…