Kinsus explores AlN ceramics beyond glass for AI advanced packaging

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 28 Oct, 23:50 UTC

Kinsus Interconnect Technology is exploring aluminum nitride (AlN) ceramics as a core material for substrates used in large-scale advanced packaging, seeking an alternative to glass amid ongoing brittleness and reliability challenges, according to R&D vice president Ting-hao Lin at the 2026…

Sources

• T2Kinsus explores AlN ceramics beyond glass for AI advanced packagingJP/KR/TW: Korea Herald / Taipei Times / DigiTimes28 Oct, 23:50