Research Insight: Kinsus Tech identifies three challenges for larger AI chip packages

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 28 Oct, 23:51 UTC

Surging demand for AI computing is driving advanced packaging toward larger form factors, according to Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, speaking at the 2026 TPCA Show. To support this trend, substrate materials must deliver low warpage and exceptional…