Lam and Imec pursue 3-D integration

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 28 Oct, 06:16 UTC

Lam and imec are collaborating to accelerate manufacturing readiness for 3D integration technologies supporting advanced packaging and next-generation memory. By bringing together Lam’s capabilities in deposition and etch with imec’s […] The post Lam and Imec pursue 3-D integration appeared first…

hardware

Sources

• T2Lam and Imec pursue 3-D integrationSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly28 Oct, 06:16