TLB develops SOCAMM3 substrates; Vietnam plant to break ground

T2Covered by 1 source · first reported by DigiTimes (headlines) at 28 Oct, 00:42 UTC

South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers at home and abroad, according to sources. The company expects SOCAMM3 to enter mass production in 2028 as it expands…