Simmtech steps up SOCAMM investment as BT substrate supply tightens

T2Covered by 1 source · first reported by DigiTimes (headlines) at 28 Oct, 00:43 UTC

Major package substrate makers, including Samsung Electro-Mechanics (Semco), are concentrating capital spending on large, high-layer-count ABF substrates, while capacity expansion for BT substrates used in memory packaging remains limited. With BT substrate supply tightening and demand for…

hardware

Sources

• T2Simmtech steps up SOCAMM investment as BT substrate supply tightensDigiTimes (headlines)28 Oct, 00:43