TSMC reportedly weighs 20% CoWoS price increase as Nvidia Blackwell and Rubin chips put pressure on packaging capacity — equipment lead times stretch to eight months
TSMC is reportedly weighing a price increase of up to 20% for its CoWoS advanced packaging technology as Nvidia’s Blackwell and upcoming Rubin chips intensify pressure on capacity. Equipment deliveries now reportedly take up to eight months, while separate wafer-price increases of 5% to 10% are…