Chip Industry Technical Paper Roundup: Oct. 27

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 27 Oct, 07:01 UTC

3D DRAM-on-GPU thermal design; multi-tier CFET self-heating and parasitics; 200G/λ silicon photonics; dry-deposited EUV and e-beam resists; neural-network-based SPICE modeling for 3nm; security-aware 3D CiM mapping; Pt-W absorbers for high-NA EUV masks. The post Chip Industry Technical Paper…

hardware

Sources

• T2Chip Industry Technical Paper Roundup: Oct. 27Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly27 Oct, 07:01