Applied Materials to raise Besi stake to 20% as hybrid-bonding orders surge

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 27 Oct, 03:27 UTC

Applied Materials plans to increase its stake in Dutch semiconductor equipment maker BE Semiconductor Industries (Besi) to approximately 20% from 9%, deepening its involvement in advanced chip packaging as demand for hybrid-bonding equipment accelerates.

hardware

Sources

• T2Applied Materials to raise Besi stake to 20% as hybrid-bonding orders surgeJP/KR/TW: Korea Herald / Taipei Times / DigiTimes27 Oct, 03:27