Cheng Mei develops materials for advanced packaging glass substrates

T2Covered by 1 source · first reported by DigiTimes (headlines) at 26 Oct, 23:50 UTC

As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges. Its cutting and grinding tapes have entered customer validation and small-volume testing, while its anti-warpage film…