Micron plans to use wafer bonding and High-NA EUV for next-gen DRAM

T2Covered by 1 source · first reported by Tom's Hardware at 26 Oct, 14:00 UTC

Micron rejects 4F2, intends to use wafer bonding and High-NA EUV before going 3D NAND over the next few years.

hardware

Sources

• T2Micron plans to use wafer bonding and High-NA EUV for next-gen DRAMTom's Hardware26 Oct, 14:00