Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 26 Oct, 07:02 UTC

Researchers at imec published “Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration.” Summary: Researchers evaluated a 3D memory architecture that rotates DRAM dies vertically above a GPU and places cooling cavities between them as an alternative to conventional 2.5D…

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Sources

• T2Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly26 Oct, 07:02