HiSilicon Backs NearLink SLE 3.0 Evolution Blue Paper at CEIC 2026 in Shenzhen

T2Covered by 1 source · first reported by China: SCMP Tech / TechNode / Pandaily / KrASIA / Sixth Tone at 23 Oct, 07:17 UTC

Shanghai HiSilicon used the Consumer Electronics Innovation Conference (CEIC) 2026 in Shenzhen, held October 22 to 24, to cast OpenHarmony, NearLink short-range...