US signs up to US$389 million in CHIPS R&D deals for power chips and fusion

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 23 Oct, 03:56 UTC

The US Department of Commerce has signed letters of intent with four companies to provide up to US$389 million in federal research and development awards under the CHIPS and Science Act, targeting the semiconductors and materials used to control, convert, and deliver power. The department announced…