UMC, AP Memory advance AI chip power delivery with validated DTC silicon capacitors for advanced packaging

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 23 Oct, 00:36 UTC

UMC and AP Memory announced a technology and manufacturing partnership on October 22 to develop next-generation power delivery solutions for AI data centers, combining UMC's deep trench capacitor (DTC) technology and wafer manufacturing capabilities with AP Memory's silicon capacitor design and…

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Sources

• T2UMC, AP Memory advance AI chip power delivery with validated DTC silicon capacitors for advanced packagingJP/KR/TW: Korea Herald / Taipei Times / DigiTimes23 Oct, 00:36