Teradyne Targets Edge AI Test Costs With UltraFLEXplus S Series

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 22 Oct, 13:00 UTC

Teradyne has introduced the UltraFLEXplus S series, extending its semiconductor test platform to address the manufacturing economics of edge artificial intelligence. Announced on October 12, 2026, the series begins with the UltraFLEXplus S24, a 24-slot system intended for engineering and production…

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Sources

• T2Teradyne Targets Edge AI Test Costs With UltraFLEXplus S SeriesSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly22 Oct, 13:00