High-end ASIC demand drives TGV adoption as TPK weighs further Taiwan expansion

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 21 Oct, 23:47 UTC

As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via (TGV) technology has emerged as a major focal point for the semiconductor industry due to its ability to enable…