CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
Chinese DRAM maker CXMT is targeting higher-density manufacturing. At a recent shareholder meeting, management pledged to enter what it called the "uncharted territory" of extreme memory scaling, using process innovation to overcome technical barriers.
Sources
- T2CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026DigiTimes (headlines)