Contrel, FSE combine laser and plasma processes for advanced packaging

T2Covered by 1 source · first reported by DigiTimes (headlines) at 21 Oct, 00:37 UTC

Contrel Technology and FSE jointly showcased dual-core laser micromachining and plasma process technologies at TPCA Show 2026, targeting advanced packaging and high-end substrate manufacturing. The companies' solutions span key processes from surface treatment and residue removal to laser trimming…