Unimicron chairman sees substrate sizes reaching 14x current scale by 2030

TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance computing (HPC) will require more than semiconductor process scaling. Advanced packaging and heterogeneous…

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Unimicron chairman sees substrate sizes reaching 14x current scale by 2030 · TechNews