Unimicron chairman sees substrate sizes reaching 14x current scale by 2030
TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance computing (HPC) will require more than semiconductor process scaling. Advanced packaging and heterogeneous…
Sources
- T2Unimicron chairman sees substrate sizes reaching 14x current scale by 2030JP/KR/TW: Korea Herald / Taipei Times / DigiTimes