Daeduck Electronics targets 2029 ceramic substrates for AI packaging

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 20 Oct, 06:33 UTC

South Korean substrate maker Daeduck Electronics is accelerating development of ceramic core substrates (CCS) to address warpage and thermal-management challenges as AI semiconductor packages grow larger. The company is conducting performance and internal reliability assessments, plans to advance…