AI substrate bottleneck shifts from design to manufacturing

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 20 Oct, 04:02 UTC

AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As substrate sizes, layer counts, I/O and power requirements rise, the industry's key bottleneck is shifting from design…