Von Ardenne's flexible equipment targets unsettled panel-level packaging market

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 19 Oct, 05:55 UTC

German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions remains unresolved. Its tray-based systems can handle different substrate sizes without a new platform…