Hanmi targets 2027 Wide TC Bonder launch, expands 2.5D AI chip packaging lineup

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 19 Oct, 02:35 UTC

South Korean semiconductor equipment maker Hanmi Semiconductor showcased its high-bandwidth memory (HBM) and AI chip packaging equipment at SEDEX 2026, including the TC Bonder 4 for HBM4 production and the Wide TC Bonder, scheduled for launch in 2027. The company also introduced five 2.5D packaging…