A Composable Thermal Solver For Heterogeneous 2.5D/3D-IC Packages (Cadence, Notre Dame)

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 18 Oct, 22:51 UTC

Researchers at Cadence Design Systems and the University of Notre Dame published “A Composable AI-Accelerated Iterative Solver for 3D-IC Thermal Modeling.” Abstract: “Accurate thermal analysis of heterogeneous 2.5D/3D-IC packages is essential yet computationally prohibitive. A single full-package…

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Sources

• T2A Composable Thermal Solver For Heterogeneous 2.5D/3D-IC Packages (Cadence, Notre Dame)Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly18 Oct, 22:51