Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High Volume

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 16 Oct, 13:00 UTC

By Shaurya Seth Terafab is one of the most ambitious projects of the decade: $16.8 billion for phase one and up to $119 billion across four phases. A research fab in Austin iterates on process recipes, transistor designs, and packaging variants at a few thousand wafers per month. A volume fab in…

hardware

Sources

• T2Terafab’s Single Roof: Why Packaging, Not Lithography, Decides High VolumeSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly16 Oct, 13:00