ASML eyes hybrid bonding, report finds, as Chinese firms adopt chip packaging technique
Dutch semiconductor equipment giant ASML is expanding into next-generation hybrid bonding, a technique that creates dense electrical connections by directly joining chips or silicon wafers, according to a new report. Major Chinese companies are also adopting the technology to improve chip…
Sources
- T2ASML eyes hybrid bonding, report finds, as Chinese firms adopt chip packaging techniqueChina: SCMP Tech / TechNode / Pandaily / KrASIA / Sixth Tone