BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 16 Oct, 03:42 UTC

Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an investor relations event on October 15, BOE said it had completed the full manufacturing process for glass-core…

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Sources

• T2BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still aheadJP/KR/TW: Korea Herald / Taipei Times / DigiTimes16 Oct, 03:42