Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinking
China's largest chip equipment makers are buying their way into hybrid bonding, the advanced packaging step that global players from Besi to ASML are also chasing. For Chinese firms, analysts say, the stakes are different: with US export controls limiting access to the tools needed for leading-edge…
Sources
- T2Chinese chip toolmakers buy into hybrid bonding as Huawei looks beyond transistor shrinkingJP/KR/TW: Korea Herald / Taipei Times / DigiTimes