VON ARDENNE Addresses Semiconductor Panel-Level Packaging Market with New HiPIMS Deposition Solution

T2Covered by 1 source · first reported by Semiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly at 15 Oct, 13:41 UTC

VON ARDENNE, a global leader in high-precision vacuum coating equipment and co-developed materials solutions, today announced that it is expanding its semiconductor deposition portfolio into panel-level packaging (PLP). The HiPIMS solution deposits high-aspect-ratio barrier and seed layers in…

hardware

Sources

• T2VON ARDENNE Addresses Semiconductor Panel-Level Packaging Market with New HiPIMS Deposition SolutionSemiconductor Engineering / SemiWiki / EE Times / EE Journal / Electronics Weekly15 Oct, 13:41