SK Hynix targets January 2027 for HBF standard, eyes DRAM stacked on AI chips

T2Covered by 1 source · first reported by DigiTimes (headlines) at 15 Oct, 06:46 UTC

SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference systems. The South Korean chipmaker is also exploring ways to stack DRAM directly on AI processors to improve…