Commentary: Huawei's 2027 Kirin roadmap — can LogicFolding overcome chipmaking constraints?

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 15 Oct, 06:03 UTC

On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding and hybrid bonding technologies. Xu Songyu, head of wireless terminal chip product management at Huawei's…