Column: 3D memory could redraw chip competition, weaken US sanctions on China

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 15 Oct, 05:59 UTC

In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D NAND with 128 layers or more, and restrictions on support provided by US persons.

hardwarepolicy

Sources

• T2Column: 3D memory could redraw chip competition, weaken US sanctions on ChinaJP/KR/TW: Korea Herald / Taipei Times / DigiTimes15 Oct, 05:59