Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystem

T2Covered by 1 source · first reported by JP/KR/TW: Korea Herald / Taipei Times / DigiTimes at 15 Oct, 04:00 UTC

GlobalFoundries (GF) has reached a multiyear manufacturing agreement with TSMC to expand silicon interposer capacity at its Malta fab in New York, supplying TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced-packaging ecosystem. The agreement is expected to be worth US$2 billion over an initial…

hardware

Sources

• T2Analysis: GlobalFoundries' calculus behind US$2 billion entry into TSMC's CoWoS ecosystemJP/KR/TW: Korea Herald / Taipei Times / DigiTimes15 Oct, 04:00